Adhesion between polyimide film and copper foil is possible using NMP completely free water-based polyimide varnish! Adhesion strength data and processing conditions are included!
Our water-based polyimide varnish utilizes polyamic acid generated by regenerating unnecessary polyimide film during the processing of polyimide film through a unique chemical treatment, resulting in a "NMP completely free water-based polyimide varnish." This product can bond polyimide films and copper foils just like general-purpose polyimide varnishes. It is also applicable to uses that could not be processed due to the influence of "NMP" solvents. This document introduces adhesive strength and processing conditions.
【Representative Product】
NMP-free water-based polyimide varnish
【Features】
■ Environmentally friendly water-based polyimide varnish
■ High heat resistance and chemical resistance
■ Can be stored at room temperature
■ Suitable viscosity for coating
■ Mixing proposals with other resins are possible
■ Improvement of working environment and global environmental improvement
【Applications】
■ Wire coating varnish
■ Heat resistance enhancement for paints, conductive inks, and coatings
■ Sliding parts and materials requiring high-temperature resistance for automobiles/aircraft, etc.
■ Adhesives
■ Batteries
■ Heat-resistant paints
■ Prepreg products
*For more details, please refer to the PDF document or feel free to contact us.
